Ultrahigh Temperature, Flexible, Printed Copper Electronics

Background:

Advanced high-temperature materials, metals, and ceramics, have been widely sought after for printed flexible electronics under extreme conditions.  However, the thermal stability and electronic performance of these materials generally diminish under extreme environments.  Additionally, printable electronics typically utilize nanoscale materials, which further exacerbate the problems with oxidation and corrosion at those extreme conditions.

Technology Overview:

This invention describes three different strategies for achieving greater oxidation resistance and thermal stability of printable copper ink.  The three strategies involve: 1) Passivating the copper ink on an atomic scale with a structural surface coating (preserves nanostructure) or alloying for oxidation and corrosion resistance and, alternatively, hybridizing the copper with additives for enhanced conductivity and temperature stability; 2) Utilizing flexible ceramic (low thermal mass and high thermal conductivity) or ceramic aerogel (super insulation at high temperature) substrates for thermal management; and 3) Using advanced surface deposition methods for further protection from oxidation and high temperature effects.

Advantages:

• High electric conductivity (5.6 MS/m) and thermal stability above 400°C.
• Thermal management and stability above 1000°C of printed electronics.

Applications:

• Flexible Hybrid Electronics (FHEs).
• Hypersonics.

Intellectual Property Status:

Provisional Patent Application 63/381,524 filed on October 28, 2022.

Stage of Development:

Lab scale demonstration.

Licensing Status:

Licensed to Copprium, Inc. Copprium is seeking customers for its high-performance conductive copper inks.

Additional Information:

Nano Lett. 2021, 21, 21, 9279–9284